Socket your 96, 78, 64 pin BGA using Extreme Temperature Socket with Superior Electrical Performance !! Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for memory devices – CBT-BGA-6048. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the […]
Amphenol-LTW introduces its brand new Q8 push-lock connector series for your space-constraint applications. With audible feedback and guided key design, this Q8 Series ensures error-proof and easy assembly for blind mating. A simple quick and safe release to save you time and cost, with just a small pull force. Designed to meet IP68 waterproof protection […]
Socket your 153 pin BGA packages on any PCB without significant performance loss and with no soldering and no mounting hardware or screws !! Ironwood Electronics has recently introduced a new high performance BGA socket for 0.5mm pitch BGA 153 pin IC's. The SG-BGA-7292 socket is designed for a eMMC memory package and operates at […]
The MX series are silicon MEMS resonator based oscillators. These silicon based items offer a very high shock and vibration resistance up to 50000G. Features: All MX packages are available in frequency range from 1.0MHz to 137MHz operating temperature ranges from -20°C to +70°C up to -55°C to +125°C overall freq stability down to +/-20ppm […]
Socket and Test your 11.5x13mm BGA device using extreme temperature socket !! Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA153 – CBT-BGA-7037. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 […]
SOIC package can be installed in boards made for DIP devices, saving the cost and time of re-spinning the PCB !! Ironwood Electronics' new adapter for the 14 pin DIP device allow use of the equivalent IC in SOIC package to be used in PCB boards developed for DIP packages. The PC-SOIC/DIP14-06 is mapped specifically […]
As part of KEL`s Hi-Packel family, the 8800 Series of half-pitch connectors, renowned for unswerving reliability and performance, fully utilizes a straight-beam construction with two lateral contact points. In order to provide full support for a wide range of applications, this diverse series features a multitude of different variations. KEL 8800 half-pitch connectors are the […]
Andon’s BGA Sockets and Adapters provide an ideal method for mounting ball grid array devices onto a PCB. The device is soldered to the adapter, greatly simplifying solder verification and testing. The device/adapter assembly then plugs into the BGA socket, which is permanently soldered to the PCB. The BGA adapter is offered with either flat or countersunk heads. Our BGA sockets can […]
Users can socket their 200 pin 0.65mm pitch BGA with socket whose footprint same as IC footprint !! Ironwood Electronics' new high performance socket – SFS-BGA200B-52 allows 0.65mm pitch, 11×14.5mm body, 12X22 array 200 ball BGA package to be placed in socket and operated without compromising performance in high speed applications. The Giga-snaP™ BGA socket adapter pair […]
Quickly and easily Socket your 0.4mm pitch BGA packages on any application board with performance equivalent to direct solder version !! Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SMP-BGA-8007 socket is designed for 6.064×6.464 […]
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