GT sockets are ideal for prototyping and testing almost any BGA device application that requires high signal integrity. This new elastomer technology has silver particles held in a conductive column like buttons which are embedded in a non-conductive polymer substrate on a proper pitch that provides high compliance and works in extreme temperature ranges.
Quickly and easily Socket your 1mm pitch 28×28 array, BGA783 packages on any application board with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55 °C to +160 °C.
Spring pin socket with 2.5 Watt heat dissipation through heat sink and fan. It also features low force 14g per contact spring pin along with high bandwidth 31.7GHz for high speed applications. Clamshell lid with compression heatsink screw allows gradual pressure to WLCSP.
Stamped Spring Pin Sockets for High Speed Applications Stamped Spring Pin (SBT) sockets excel in both high insertion count and demanding thermal requirements. The SBT contact is a stamped contact with an external spring and a connecting inner leaf spring. SBT sockets offer low cost and better electrical/mechanical performance than conventional pogo pin sockets while […]
Constructed with stamped spring pin technology rated for 23GHz bandwidth with operating temperature range of -55 °C to +180 °C. Current capacity is 4 Amps with self-inductance of 0.93 nH and capacitance of 0.097 pF. With lever operation, it is easy to swap device and characterize
Board-to-Board Connector for High Speed Applications Connectors using spring pin, elastomer and pin / socket interconnect technology provide up to 94GHz signal speed in a smallest footprint for prototype and production applications. These rugged interconnects utilize our laser-and-laminate process for rapid development and short lead-times, without expensive hard tooling. These connectors support pitches from 0.3mm […]
Socket and Test your 4.2×3.8mm BGA device using extreme temperature socket Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA35 – CBT-BGA-7525. The contactor is a stamped spring pin with 8 gram actuation force per ball and cycle life of 75,000 insertions. The self inductance of the […]
Chip size socket connects LPDDR5 to system PCB with minimal signal loss. Supported device size is 14x14mm, 21×21 array, 0.65mm pitch BGA 441. Once the socket is soldered down to PCB, device can be simply plugged into it. This Grypper socket has excellent electrical performance of – 1dB insertion loss greater than 25.0 GHz. Force […]
Image Sensor Sockets: A Key Factor in Camera Design The proliferation of valuable high-resolution, high-speed, and 3D image sensors makes the use of sockets an increasingly important factor in camera development. Camera makers — and, therefore, image sensor makers — today are under greater pressure than ever to offer new models that provide higher resolution […]
The SM-BGA socket is constructed with high performance (> 40GHz bandwidth) and low inductance elastomer contactor. The temperature range is -55 °C to +150 °C. The pin self-inductance is 0.21 nH. Capacitance to ground is 0.15 pF. Current capacity is 4 amps per pin.
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