Quickly and easily socket your optoelectronic module (BGA64, 0.45mm pitch, 7.7x10mm size) and verify the performance equivalent to direct solder version using a high performance spring pin with low inductance of 0.17nH that operates from -40°C to +120°C.

Constructed with stamped spring pin technology with copper compression plate for heat dissipation along with thermocouple location for monitoring temperature. With swivel lid operation, it is easy to swap the device and characterize. High Performance Sockets & Adapters ©2023 Ironwood Electronics. All rights reserved

Ironwood Electronics has released a new product group called, Thermal Socket, specifically supporting the test of high power devices. These thermal sockets utilize water-cooled solutions. There are a few different types of water-cooled solutions. Closed-loop all in one coolers is the better choice since they are pre-assembled and sealed units that include a pump, water […]

With lever operated mechanism quickly and easily socket your 0.92mm pitch, 56x45mm size with 3184 contacts on any development platform with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55 °C to +160 °C along with liquid cooled lid that dissipates 300 watt power.

GT sockets are ideal for prototyping and testing almost any BGA device application that requires high signal integrity. This new elastomer technology has silver particles held in a conductive column like buttons which are embedded in a non-conductive polymer substrate on a proper pitch that provides high compliance and works in extreme temperature ranges.

Quickly and easily Socket your 1mm pitch 28×28 array, BGA783 packages on any application board with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55 °C to +160 °C.