Quickly and easily Socket your 0.4mm pitch BGA packages on any application board with performance equivalent to direct solder version !!
Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SMP-BGA-8007 socket is designed for 6.064×6.464 mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The socket is also designed to dissipate few watts with aluminum compression screw assembled on the swivel lid and can be customized up to 100 watts with modified fin design on top of the screw and adding axial flow fan. The contact resistance is typically 15 milliohms per pin. The socket connects all pins with 40 GHz bandwidth on all connections. The socket is mounted on the target PCB with no soldering, and uses mechanical hardware for mounting. The socket is constructed with swivel lid which incorporates a quick insertion method so that IC's can be changed out quickly for engineering verification before installing into the ATE.
The SMP-BGA-8007 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -55 °C to +150 °C. The pin self inductance is 0.10 nH and mutual inductance of 0.007 nH. Capacitance to ground is 0.069 pF. Current capacity is 4 amps per pin. It comes with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive silver columns. This plunger matrix protects the conductive silver columns from contamination due to various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. Silver column with plunger matrix contact is rated for >500K cycles.