Industry’s Smallest Footprint
- Up to 500,000 insertions
- Bandwidth up to 50+ GHz
- 2.5mm per side larger than IC
- Ball Count over 5000, Body Size 2 – 100mm
- < 25 mOhm Contact Resistance
- -55°C to +180°C
- 4A to 8A @80°C
- BGA, LGA, QFN, QFP and SOIC
- Optional heatsinking to 400W
- Six different Lid Options
- Quick Turn Customs
©2020 Ironwood Electronics. All rights reserved
