Socket and Test your 11.5x13mm BGA device using extreme temperature socket !! Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA153 – CBT-BGA-7037. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 […]
The 88 Series fully utilizes the concept of straight-beam construction with two lateral contact points and offers excellent positioning thanks to a three-sided protective molding; furthermore, as a standard in the field of half-pitch connectors, this series boasts a wide range of variations with proven track records. The 8806 and 8807 connectors represent the multi-contact type […]
The 89 Series of low-profile, half-pitch connectors utilizes the concept of securely-fit, one-point contacts. Having the most compact design and lowest profile of all KEL half-pitch connectors, and also featuring a guide mechanism, this product is ideal for SMT applications. The connectors of the 8900 Series have become the de facto standard for removable-media applications […]
SOIC package can be installed in boards made for DIP devices, saving the cost and time of re-spinning the PCB !! Ironwood Electronics' new adapter for the 14 pin DIP device allow use of the equivalent IC in SOIC package to be used in PCB boards developed for DIP packages. The PC-SOIC/DIP14-06 is mapped specifically […]
As part of KEL`s Hi-Packel family, the 8800 Series of half-pitch connectors, renowned for unswerving reliability and performance, fully utilizes a straight-beam construction with two lateral contact points. In order to provide full support for a wide range of applications, this diverse series features a multitude of different variations. KEL 8800 half-pitch connectors are the […]
Andon’s BGA Sockets and Adapters provide an ideal method for mounting ball grid array devices onto a PCB. The device is soldered to the adapter, greatly simplifying solder verification and testing. The device/adapter assembly then plugs into the BGA socket, which is permanently soldered to the PCB. The BGA adapter is offered with either flat or countersunk heads. Our BGA sockets can […]
Users can socket their 200 pin 0.65mm pitch BGA with socket whose footprint same as IC footprint !! Ironwood Electronics' new high performance socket – SFS-BGA200B-52 allows 0.65mm pitch, 11×14.5mm body, 12X22 array 200 ball BGA package to be placed in socket and operated without compromising performance in high speed applications. The Giga-snaP™ BGA socket adapter pair […]
Quickly and easily Socket your 0.4mm pitch BGA packages on any application board with performance equivalent to direct solder version !! Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SMP-BGA-8007 socket is designed for 6.064×6.464 […]
Socket your 2104 pin BGA packages with low force lever actuation and high speed elastomer Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch BGA 2104 pin Xilinx IC. The CG-BGA-4022 socket is designed for 47.5X47.5mm package size and operates at bandwidths up to 27 GHz with less than 1dB […]
Ironwood Electronics is pleased to offer various high performance contact technologies such as elastomer and spring pins to match customer specific application requirements. The socket design plays a major role in the successful utilization of the test socket. Consider the following socket lid types: The swivel lid uses the smallest footprint in the industry and […]
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