High Performance IC Sockets and Adaptors: An economical and reliable alternative to soldering BGA devices directly to the motherboard. Same footprint as BGA device. Compact, low-profile design maximizes PC board space. Ironwood has Fastest Delivery. Soldering Very Similar to Soldering IC Package. PCB can be reflowed with Giga-snaP. Access to BGA Pads for Test & Interconnection. Pin Counts from […]

Users can connect their 724 pin 1mm pitch BGA device via BGA socket adapter to the mother board with excellent signal integrity !!  These BGA socket adapters passed environmental tests (MIL-STD) and qualified for various range of applications including automotive, military, communications, industrial, etc. The BGA socket adapter line is available in many different pin […]

GT is a new elastomer technology that has silver particles held in a conductive column like buttons which are embedded in a nonconductive polymer substrate on a proper pitch that provides high compliance and extreme temperature ranges. GT is available for BGA, LGA, QFN, PoP and other packages from 0.15mm to 1.27mm pitch.  

Ironwood's GT sockets are ideal for prototyping and testing almost any BGA or QFN device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 75GHz) and supports BGA or QFN packages with pitches down to 0.15mm was utilized in these sockets. […]

Ironwood Electronics has recently introduced a new high performance QFN socket for 0.5mm pitch QFN40. The CG-QFN-7009 socket is designed for 6X6 mm package size and operates at bandwidth up to 10 GHz with less than 1dB of insertion loss. The socket is designed with easy open single latch snap lid with integrated spring loaded […]

Hi-Reliability Ultra Low Profile Carrier Socket Assemblies ·  Eliminate hand loading individual terminals ·  Prevents Contact Contamination During Soldering · Available in Any Configuration Carrier Socket Assemblies carry low profile terminals through your soldering process to provide a space saving perfectly pependicular, coplanar, and substrateless socket after soldering. After assembly, the carrier is either discarded or send back to factory […]

Xilinx XC6SLX16-2CSG324C can be used on an existing Xilinx XCV300-4PQG240I 240 position QFP SMT lands via cost effective leadless adapter. Ironwood Electronics' new Xilinx device converter – DC-BGA-XC6SLX16/QFP-XCV300-01 allows customers to use a low cost Xilinx Spartan-6 family embedded FPGA with optimized logic and High speed serial connectivity in place of Xilinx Virtex XCV300-4PQG240I FPGA. These device […]

Loranger Offers Test and Burn-in Sockets with 0.22 mm and Greater Pitches !! As more and more semiconductor components are produced in smaller packages with finer pitches, equally detailed socket manufacturing is required. Loranger has met our customer’s requirements for fine pitched sockets with advanced APS sockets. Loranger sockets are designerd with contact pitches down […]