SBT contact replaces spring pin in all lab and evaluation applications due to low cost and better electrical/mechanical performance than conventional pogo pin. Custom burn-in socket can be produced using SBT contact in 3 weeks when standard socket is not available. SBT sockets with wide temperature range are available in same footprint as elastomer GHz sockets. SBT sockets are robust and can be […]

Lever Actuated Spring Pin Socket for BGA320 Socket your 320 pin BGA using Extreme Temperature Socket with Superior Electrical Performance Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Micro Controller Unit – CBT-BGA-6084. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 […]

Socket your BGA96 using Extreme Temperature Socket with Superior Electrical Performance Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for DDR – CBT-BGA-6081. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of […]

Ironwood has the largest, most experienced engineering staff in our industry. Fast, high quality, quick turn custom projects are our specialty. We can provide complete turn-key solutions for subsystems and IC upgrades. Complete turn-key solution involves design service, component procurement service, component manufacturing, final assembly, X-ray/AOI service, functional/parametric testing and customized packaging.

We offer many adapters for converting IC packaging and device pin outs, solving many IC availability and performance issues. We also offer fix adapters to solve layout problems and some known chip deficiencies. Custom, quick turn solutions are our specialty.

GHz BGA & QFN/MLF sockets provide excellent signal integrity in a small, cost effective ZIF (Zero Insertion Force) socket for prototype and test applications. Our sockets support pitches down to 0.3mm.

Giga-snaP™ line of BGA adapters provide the most reliable interconnect to BGA SMT pads. These patent pending adapters remain attached through many solder cycles reliably and will not warp as plastic molded parts. Insertion force is half of competitive products and better transmission of high frequency signals due to shortest connection length.