Description

                              Zero Footprint – No Lid Required – S21 Electrical Performance > 40 GHz

        Open Nand Flash Interface (ONFi) specify a unique package & I/O configurations. This catalog covers the variations within the ONFi specifications. LGA & leaded devices can be tested using the HSIO Copper Pillar technology.

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Typical Applications	Ball Count – Socket size – Pitch-Product	Device Ball Diam. +/- 0.05 mm	Option with SAC 305 Solder Balls	Option with Eutectic Solder Balls	Standard – No Solder Balls
	63 – 9.0 x 11.0 – 0.8 – Grypper	0.45	105526-0097	105526-0090	105526-0082
	Device Press – 9.0 x 11.0		103864-0048
	Stencil MOQ (10)		N/R	N/R	104553-0083
	100 – 12.0 x 18.0 – 1.0 – Grypper	0.45	105526-0089	105526-0088	105526-0057
	Device Press – 12.0 x 18.0		103864-0083
	Stencil – 100 – 12.0 x 18.0		N/R	N/R	104553-0133
	132 – 12.0 x 18.0 – 1.0 – Grypper	0.50	104670-0040	104670-0043	104670-0032
	Device Press- 12.0 x 18.0		103864-0083
	Stencil – 132 – 12.0 x 18.0		N/R	N/R	104553-0217
	152 – 14.0 x 18.0 – 1.0 – Grypper	0.50	104670-0041	108656-0036	104670-0036
	Device Press – 14.0 x 18.0		103864-0116
	Stencil – 152 – 14.0 x 18.0		N/R	N/R	104553-0248
	272 – 14.0 x 18.0 – 0.8 – Grypper/G80	0.55	107206-0052	107206-0016	107206-0013
	Device Press – 14.0 x 18.0		103864-0116
	Stencil – 272 – 14.0 x 18.0		N/R	N/R	104553-0354
	316 – 14.0 x 18.0 – 0.8 – Grypper/G80	0.50	107088-0011	107088-0012	107088-0010
	Device Press – 14.0 x 18.0		103864-0116
	Stencil – 316 – 14.0 x 18.0				104553-0289

Options: With Solder balls: SAC 305 or Eutectic !

Actual device measurements should be reviewed to ensure proper fit with socket contacts.
Extraction Tool: 105900-0004

Reference JEDEC and ONFi Specifications; JEDEC – JESD230 and ONFi 3.2 Standards for standard device pin configurations.