SS-LGA Spring Pin (Pogo) Sockets-PART 1-6 · Ironwood

Spring Pin Sockets

The Spring Pin Socket line allows very high endurance and wide temperature range testing of 0.3mm to 1.27mm pitch BGA, LGA, QFN, QFP and SOIC devices on the same footprint as other Ironwood socket technologies. This allows different PCB’s with same footprint to accomplish many different test applications.

CATALOG

Description

Sockets for High Temperature & High Endurance Applications

Spring pin sockets provide high bandwidth in a small, cost effective design. Spring pin socket is a simple, mechanical socket based on Pogo (spring) pin technology. Spring pin socket is a solder-less socket that can be mounted on to a PCB using supplied hardware. The PCB should have mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). The typical Spring pin socket footprint is only 5mm larger than the maximum IC size which means series resistors, capacitors, tuning inductors and others can be placed minimal distance from IC in GHz applications. The socket is mounted to the PCB with a backing plate and for all IC body sizes, spring pin sockets require a rigid metal backing plate to prevent deflection of the target circuit board due to a high normal force required to compress the spring pins. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB. The socket is constructed of aluminum to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The user simply places the IC into the socket, closes the lid, and rotates the heat sink screw to connect the IC. It is compatible with the alternate SG-BGA (elastomer) socket footprint and other socket technologies as well. If there are pre-existing holes in the PCB, a Spring pin socket can be custom designed to accommodate those holes.

 PART
NUMBER 
 ROHS   IC Size
X (mm) 
 IC Size
Y (mm) 
 IC Size
Tolerance (mm) 
 Top
Pitch (mm) 
 SS-LGA144B-M-01   yes   12   12   0.2   0.8 
 SS-LGA318A-M-01   yes   15   15   0.2   0.8 
 SS-LGA324A-M-01   yes   23   13   0.2   1 
 SS-LGA376A-01   yes   23   23   0.2   1 
 SS-LGA48A-01   yes   6   8   0.2   0.80 
 SS-LGA675A-01   yes   27   27   0.3   1 
 IC
Array X 
 IC
Array Y 
 Max
Pincount 
 Max
Package Code 
 Full
Array 
 Part
Description
 12   12   144   LGA144B   yes   Spring Pin (Pogo) Sockets 
 18   18   318   LGA318A   N/A   Spring Pin (Pogo) Sockets 
 22   22   324   LGA324A   N/A   Spring Pin (Pogo) Sockets 
 24   24   376   BGA376A   no   Spring Pin (Pogo) Sockets 
 9   11   48   LGA48A   yes   Spring Pin (Pogo) Sockets 
 26   26   675   LGA675A   no   Spring Pin (Pogo) Sockets