Memory Probing Adapters-PART 1-6 · Ironwood

Prototyping Adapters

Ironwood offers a number of DDR3 Memory Probing Adapters that support high speed probing using Agilent logic analyzers. These adapters incorporate vendor-specific interfaces and clean, controlled impedance signals.

CATALOG

Description

Memory Probing Adapters 

Proto Adapters – Simplifies system development

Mounted in place of a memory device, Ironwood’s line of Memory Probing adapters eliminate the need to design debug features into target systems. Our Memory Probing Adapter allows high-speed testing of DDR3 memory device while accessing the signals using testers via test pads located on left and right wings. Real time, high speed analysis of target systems requires excellent signal integrity. Our pluggable components employ gold plated connections. Features of the Memory Probing adapter include controlled impedance, shortest possible trace length for maximum speed, low inductance, low capacitance, blind and buried via PCB design technology. Memory Probing adapter is designed to interface various 0.8mm pitch, 1.0mm pitch Ball Grid Array packages to SMT pads on the target PCB while bringing the signals out for probing.

Ironwood’s Memory Probing Adapter consists of rigid flex PCB with solder balls on the bottom side. The Memory probing adapter can be soldered to the target system board in place of Memory device using standard BGA soldering methods. DDR3 memory device can be soldered on the top side of probe adapter that employs a flex wing design to deliver all data, address, control, and other signals to test pads on 0.4mm centers. The flex wing test pads can be interfaced to logic analyzer or other test equipment using appropriate cable connector. Alternatively, this probe adapter can be used inside a BGA socket for solderless solution.

Ironwood offers a number of DDR3 Memory Probing Adapters that support high speed probing using Agilent logic analyzers. These adapters incorporate vendor-specific interfaces and clean, controlled impedance signals.

 PART
NUMBER 
 RoHS   DRAM
Type 
 Data
Width 
 MPA-DDR3x16-BGA96H-01   DDR3 96 ball BGA non-Stacked SDRAM   x16   E5845A, U4201A 
 MPA-DDR3x16-BGA96L-01   DDR3 96 ball BGA Stacked SDRAM   x16   E5845A, U4201A 
 MPA-DDR3x16-BGA96L-02   DDR3 96 ball BGA non-Stacked SDRAM   x16   E5845A, U4201A 
 MPA-DDR3x4x8-BGA78F-01   DDR3 78 ball BGA SDRAM   x4/x8   E5847A 
 MPA-DDR3x4x8-BGA78G-01   DDR3 78 ball BGA TwinDie SDRAM   x4/x8   E5845A, U4201A 
 MPA-DDR3x4x8-BGA82A-01   DDR3 82 ball BGA TwinDie SDRAM   x4/x8   E5845A, U4201A 
 Compatible
Agilent Cables 
 IC Size
X (mm) 
 IC Size
Y (mm) 
 Max
Package Code 
 8   14   BGA96H   Based on MICRON MT41J256M4 DDR3 SDRAM 
 11   13.3   BGA96L   Based on SAMSUNG K4B8G1646B DDP DDR3 SDRAM; Hynix H5TQ1G43AFP-xxC DDr3 SDRAM (x16) 
 11   13.3   BGA96L   Based on SAMSUNG K4B8G1646B DDP DDR3 SDRAM 
 7.5   11   BGA78F   Based on SAMSUNG K4B2G0446D, K4B2G0846D DDR3 SDRAM 
 8   11.5   BGA78G   Based on Hynix H5TQ1G43AFP-xxC DDr3 SDRAM (x8); MICRON MT41J1G4 TwinDie DDR3 SDRAM; 
 12.5   15   BGA82A   Based on MICRON MT41J1G4 TwinDie DDR3 SDRAM