SOIC to DIP-PART 1-20 · Ironwood

Package Converters & Fix Adapters

We offer many adapters for converting IC packaging and device pin outs, solving many IC availability and performance issues. We also offer fix adapters to solve layout problems and some known chip deficiencies. Custom, quick turn solutions are our specialty.

These adapters allow SOIC packages to be mounted on DIP through hole patterns. The SOIC device is soldered to the adapter’s surface mount lands, giving the highest possible reliability. The adapter will accomodate J-leaded or gull wing SOIC devices.

CATALOG

Description

Package Converters & Fix Adapters

Package converters provide an electrical and mechanical conversion from one package type to another. We use gold plated interconnects for our pin and through hole converters.
Ironwood Electronics offers solder column adapters as a solution for leaded SMT packages such as QFP, PLCC, SOIC, SSOP, and TSOP. This is an excellent choice when you have a PC board in production that needs an upgrade or you need to replace an obsolete part. The solder column adapter provides a fast, highly reliable connection at a fraction of the cost of competing designs. This makes it an excellent choice for either prototype or production quantities.
The solder column adapter efficiently adapts one footprint to another footprint in a low-profile, compact design. The solder column adapter mounts directly to the SMT pads with a footprint no larger than the actual target land pattern. They are available with a 1:1 connection or a custom net list. Our state of the art design and manufacturing capabilities allow us to replace and upgrade the functions in legacy IC’s. Parts can be manufactured as RoHS or non-RoHS compliant depending on your application.
We offer products for each of the following package conversions. The part families are listed in “top interface to bottom interface” order.

 PART
NUMBER 
 RoHS   Top
Package Code  
 Bottom
Package Code 
 Top
Pin Count 
 Bottom
Pin Count 
 Top
Interface 
 PC-SOIC/DIP14-01   Call*   SO14A_SO14B_SO14D_SOJ14A   0.3   14   14   SOIC Land Pattern 
 PC-SOIC/DIP14-01W   Call*   SO14A_SO14B_SO14D_SOJ14A   0.3   14   14   SOIC Land Pattern 
 PC-SOIC/DIP14-02   Call*   SO14C   0.3   14   14   SOIC Land Pattern 
 PC-SOIC/DIP14-03   Call*   SO14C   0.6   14   14   SOIC Land Pattern 
 PC-SOIC/DIP14-04   Call*   SO14G   0.3   14   14   SOIC Land Pattern 
 PC-SOIC/DIP14-05   Call*   SO14G   0.6   14   14   SOIC Land Pattern 
 PC-SOIC/DIP16-01   Call*   SO16A_SO16F   0.6   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-01W   Call*   SO16A_SO16F   0.6   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-02   Call*   SO16B   0.3   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-02F   yes   SO16B   0.3   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-02W   Call*   SO16B   0.3   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-03   Call*   SO16A_SO16C_SOJ16A   0.3   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-03W   Call*   SO16A_SO16C_SOJ16A   0.3   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-04   Call*   SO16A_SO16C_SOJ16A   0.3   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-05   Call*   SO16E   0.3   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-06   Call*   SO16E   0.6   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-07   Call*   SO16D   0.3   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-08   Call*   SO16D   0.6   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-09   Call*   SO16G   0.3   16   16   SOIC Land Pattern 
 PC-SOIC/DIP16-10   Call*   SO16G   0.6   16   16   SOIC Land Pattern 
 Bottom
Interface 
 IC Package
Lead Tip to Tip mm
 Bottom
Array Size 
 Adapter Size
Length X Width in.
 Bottom
Pitch mm
 Part
Description 
 Thru Hole Pins   0.125 – 0.325   N/A   0.7 x 0.4   2.54   SOIC to DIP Converter 
 WW/Thru Hole Pins   0.125 – 0.325   N/A   0.7 x 0.4   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.246 – 0.252   N/A   0.7 x 0.4   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.246 – 0.252   N/A   0.7 x 0.7   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.246 – 0.252   N/A   0.7 x 0.4   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.246 – 0.252   N/A   0.7 x 0.7   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.3 – 0.5   N/A   0.8 x 0.7   2.54   SOIC to DIP Converter 
 WW/Thru Hole Pins   0.3 – 0.5   N/A   0.8 x 0.7   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.275 – 0.475   N/A   0.8 x 0.5   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.275 – 0.475   N/A   0.8 x 0.5   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.275 – 0.475   N/A   0.8 x 0.5   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.15 – 0.35   N/A   0.8 x 0.4   2.54   SOIC to DIP Converter 
 WW/Thru Hole Pins   0.15 – 0.35   N/A   0.8 x 0.4   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.15 – 0.35   N/A   0.8 x 0.4   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.236 – 0.412   N/A   0.8 x 0.4   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.236 – 0.412   N/A   0.8 x 0.7   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.246 – 0.252   N/A   0.7 x 0.5   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.246 – 0.252   N/A   0.7 x 0.7   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.246 – 0.252   N/A   0.8 x 0.4   2.54   SOIC to DIP Converter 
 Thru Hole Pins   0.246 – 0.252   N/A   0.8 x 0.7   2.54   SOIC to DIP Converter