Description
Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.4mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
| PART NUMBER |
RoHS | Top Pitch (mm) |
Max Pincount |
IC Size X (mm) |
IC Size Y (mm) |
IC Array X |
IC Array Y |
IC Size Tol.ce (mm) |
| CBT-LGA-5000 | yes | 0.75 | 110 | 25 | 21 | 30 | 30 | 0.15 |
| CBT-LGA-5001 | yes | 6.795 | 10 | 31.777 | 31.777 | 2 | 5 | 0.15 |
| CBT-LGA-5002 | yes | 20.32×17.78 | 24 | 31.75 | 31.75 | 4 | 6 | 0.15 |
| CBT-LGA-5003 | yes | 0.75 | 110 | 25 | 21 | 30 | 30 | 0.15 |
| CBT-LGA-5004 | yes | 1 | 675 | 27 | 27 | 26 | 26 | 0.3 |
| CBT-LGA-5006 | yes | 0.6/1 | 108 | 12 | 12 | 18 | 18 | 0.15 |
| CBT-LGA-5007 | yes | 0.5 | 162 | 11.5 | 13 | 10 | 20 | 0.08 |
| CBT-LGA-5008 | yes | 0.8 | 45 | 4.3 | 7.6 | 5 | 9 | |
| CBT-LGA-5009 | yes | 0.6/1 | 108 | 12 | 12 | 18 | 18 | 0.15 |
| CBT-LGA-5010 | yes | 1 | 675 | 27 | 27 | 26 | 26 | 0.3 |
| CBT-LGA-5012 | yes | 1.2 | 416 | 58 | 47 | 0.1 | ||
| CBT-LGA-5013 | yes | 1 | 625 | 29 | 29 | 25 | 25 | |
| CBT-LGA-5015 | yes | 0.514 | 49 | 3.6 | 3.6 | 7 | 7 |
| IC Total H. Max (mm) |
Pad D. max (mm) |
Backing Plate |
Max Pkg Code |
Cavity Down |
IC Top Surface |
Socket Lid |
Heat Sink |
Part Description |
| 1 | 0.6 x 0.5 | yes | LGA110 | no | Flat | Clam shell | no | Stamped pin Burn-in socket |
| 10.353 | 4.572 x 1.522 | yes | no | Components | Clam shell | no | Stamped pin Burn-in socket | |
| 0.71 | 2.032×1.524 | no | LGA24 | no | Flat | Clam shell | no | Stamped pin Burn-in socket |
| 1 | 0.6×0.5 | yes | LGA110 | no | Flat | Clam shell | no | Stamped pin Burn-in socket |
| 2.8 | 0.6 | yes | LGA675 | Mold Cap | Clam shell | no | Stamped pin Burn-in socket | |
| 0.98 | 0.25 | yes | LGA108 | no | Flat | Clam shell | no | Stamped pin Burn-in socket |
| 0.71 | 0.3 | yes | LGA162 | no | Flat | Clam shell | no | Stamped pin Burn-in socket |
| 1.45 | 0.4×0.4 | yes | LGA45 | no | Flat | Clam shell | no | Stamped pin Burn-in socket |
| 0.98 | 0.11 | yes | LGA180 | no | Flat | Clam shell | no | Stamped pin Burn-in socket |
| 2.8 | 0.6 | yes | LGA675 | no | Flat | Clam shell | no | Stamped pin Burn-in socket |
| 2.97 | 0.6 | yes | LGA416 | no | Components | Clam shell | no | Stamped pin Burn-in socket |
| 3.41 | 0.68 | yes | LGA625 | no | Flat | Clam shell | no | Stamped pin Burn-in socket |
| 0.35 | 0.275 | LGA49 | no | Flat | Snap lid | no | Stamped pin Burn-in socket |
