Quickly and easily Socket your 1mm pitch 28×28 array, BGA783 packages on any application board with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55 °C to +160 °C.
DT Series with Metal shell for measures against ESD and EMC […]
DT Series floating connector XY direction ±1.2mm movable type <Product overview> […]
FJC Series 0.75mm Pitch Crimp Connector <Product overview> – 0.75mm pitch […]
MRA Series 0.5mm pitch coaxial multi pin connector for Single-ended RF […]
Spring pin socket with 2.5 Watt heat dissipation through heat sink and fan. It also features low force 14g per contact spring pin along with high bandwidth 31.7GHz for high speed applications. Clamshell lid with compression heatsink screw allows gradual pressure to WLCSP.
