New products: the last information !!
Loranger has designed a new DoubleDuty Kelvin ClamShell sockets (P/N 04714 171 6218A) for Burn-in, Test and/or product Development that provides a double connection (Kelvin) to narrow QFN package pad. Plunger-style contacts are available for center pads of the package. The socket accommodates 0.5mm pitch having 17 I/Os with stamped contacts.Operating temperature goes to 175°C […]
Ironwood Electronics creates innovative IC interconnect solutions in prototype, test, and production applications for use in both product development and ongoing production.
Loranger International: Your Turn Key Solution for Sockets, Boards & Systems !!
Ironwood Electronics’ new high performance socket – SF-BGA656A-B-64F allows 0.8mm pitch, 23x23mm body, 28X28 array LG’s XD™ Engine to be socketed and operate without compromising performance in demanding HDTV applications.
Ironwood Electronics has recently introduced a new high performance QFN socket for 0.4mm pitch QFN 56 pin IC's. The DG-QFN56B-01 is constructed with high performance and low inductance diamond particle interconnect contactor. Contactor is capable of 100,000 insertions. The temperature range is -70 C to +200 C.
Despite their extremely small size, our connectors for micro coaxial cable possess high transmission properties. It is ideal for use in products such as mobile telephones and digital cameras that have hinging parts which are frequently turned and bent.
XSL series have a pitch of 0.25mm, the smallest in the industry, and are designed for #44 AWG and #46 AWG micro coaxial cables. Highly reliable design with effective contact displacement of 0.51mm. XSL series are designed to not reduce the superb data transmission performance of coaxial cables at connection points. The bottom shell of […]
USLS Series 0.4 mm Pitch I.D.C. Connectors for Micro Coaxial Cable (#42 AWG) Stacking Type ! The USLS Series provides a standard-connection variation of our USL Series of I.D.C. connectors for 0.4mm pitch, ultra-fine coaxial cables (#42 AWG). As mounting configurations become ever-more dense in mobile phones and other similar devices, it is becoming increasingly difficult […]
