Ironwood Grypper sockets are great for enabling fast easy swap out of BGA device for development sorting and failure analysis. The Grypper socket allow you to simply snap in the BGA device into the socket – No Lid needed. The Grypper sockets are the same size as the device ,”ZERO FOOTPRINT SOCKET”, so they will […]
Grypper sockets for UFS and eMMC devices are available from Ironwood Ironwood Electronics, continues to design and manufacture new Grypper test sockets for eMMC and UFS BGA devices. The Grypper sockets support the variety of sizes that 153 ball eMMC and UFS devices are produced, ranging from 7.5 x 7.5 mm to the 11.5 x […]
Ironwood continues to support the newest Memory devices with Grypper sockets for DDR5 Ironwood Electronics continues to support the latest development in the DDR Memory architecture with sockets to support the newest DDR5 devices with higher data rates expected to overtake DDR4 in desktops and servers. The 102 Grypper socket is similar to the DDR4 […]
Ironwood Electronics offers high performance test sockets and adapters for both engineering and production use of semiconductor devices. IC packages covered include QFN, BGA, SOIC, QFP, LGA, WLCSP and other SMT packages. Our GHz line of sockets with 6 different contact technologies supports up to 110 GHz bandwidth, >=0.2mm pitch, <=10000 pins, 500K insertions and […]
Ironwood Electronics continues to provide Grypper test solutions as the world is rapidly shifting to mobile 5G devices, which will support immense amounts of data The 297 BGA socket is one of many newer LPDDR4X and LPDDR5 Grypper test sockets. This socket uses the Grypper contacting technology that allows the test socket to be placed […]
High-performance, 0.35mm-0.5mm pitch net zero package footprint engineering test sockets for BGA style packaged devices Ironwood Electronics Grypper series test socket is the next best thing to not having a socket at all. The Grypper G40 as the superior test socket solution for low-to-high-ball-count BGA packages. Sized to match the package, the G40 Grypper test […]
High Performance Near Zero Footprint Sockets for 0.40 + pitch devices. New Y contact is less aggressive to device solder ball allowing multiple insertions of the same deviceLower insertion – positive retention with spring bias Lid. Technical Documents Grypper Y Specification Sheet Grypper Y RF Test Report Grypper Attach & Removal Grypper Insert & Removal […]
High-performance, 0.65 mm+ pitch net zero package footprint engineering test sockets for BGA style packaged devices over 200 ball count and for over 300 the G80 LIF to reduce insertion forces. Technical Documents Grypper G80 Specification Sheet Grypper G80 LIF Grypper G80 0.45 Ball 0.8 Pitch RF Characterization Summary Grypper G80 0.50 Ball 0.8 and […]
High Performance, Industry Standard Zero Footprint Sockets for 0.35 + pitch devices. Technical Documents Zero Footprint SMT Spring Pin Sockets Product Bulletin Ironwood Electronics Zero footprint (ZFP) sockets is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with […]
Same Size as Device True Zero Footprint Pluggable approx. 100 Insertions 0.35mm to 1.27mm Pitch ©2020 Ironwood Electronics. All rights reserved
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