High Speed Microwave Applications Contact resistance < 30 mOhms Bandwidth > 94GHz @-1 dB Current 5.4A @ 20C rise Force 25-50 grams per contact Operating temperature -55 to + 160 °C Insertion / Extraction cycles > 1000 Contact lenght (compressed): 0.08mm Compliance: 0.15mm ©2020 Ironwood Electronics. All rights reserved
Industry’s Smallest Footprint Up to 500,000 insertions ARM Bandwidth to 75 GHz 2.5mm per side larger than IC Ball Count over 4400, Body Size 2 – 100mm < 25 mOhm Contact Resistance throughout life Five different contactor options Optional heatsinldng to 300W Six different Lid Options ©2020 Ironwood Electronics. All rights reserved
Giga-snaP BGA SMT Adapters allow affordable socketing Ultra low insertion force GHz bandwidth Same CTE as PCB Solder’s same as IC Up to 2500 pins 0.5mm to 1.27mm pitch Same size as IC ©2020 Ironwood Electronics. All rights reserved
Industry’s Smallest Footprint Up to 500,000 insertions Bandwidth up to 75 GHz 2.5mm per side larger than IC Ball Count over 4400, Body Size 2 – 100mm Five different contactor options Optional heatsinking to 400W Six different Lid Options < 25 mOhm Contact Resistance throughout life ©2020 Ironwood Electronics. All rights reserved
Quick-Turn Custom Sockets Use on any existing PCBs No mounting holes No soldering Patented placement – epoxy system 0.32mm larger than IC (per side) Bandwidth to 80 GHz 0.3mm pitch 8 and up ©2020 Ironwood Electronics. All rights reserved
Industry’s Smallest Footprint Pitch – 0.3mm to 1.27mm – BGA, QFN (MLF) Bandwidth to 75+ GHz Six different lid options Optional 500,000 insertions Heatsinldng to 100 watts ©2020 Ironwood Electronics. All rights reserved
Quick-Turn Custom Designs Bandwidths to 75 GHz Industry’s Smallest Footprint Ideal for Prototype and Test Simulation Models Available Multi Level Stacked Sockets Five different contactor options BGA and QFN Sockets for all Xilinx, Microsemi, & Intel Chips SMT Options ©2020 Ironwood Electronics. All rights reserved
Industry’s Smallest Footprin Up to 500K+ insertions Bandwidth up to 80GHz 2.5mm per side larger than IC Ball Count over 4300, Body Size 1 – 100mm Five different contact options Six different lid options < 25mOhms contact resistance/pin ©2020 Ironwood Electronics. All rights reserved
Quickly and easily Socket your mixed pitch 29×29 array, BGA840 packages on any application board with performance equivalent to direct solder version Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 94GHz, very low inductance and wide temperature applications. The GT-BGA-2135 socket is designed for 21×21 mm package […]
QFN Socket with Compliant Cover and Heat Pipe with Optional Heat Sink Loranger offers socket solutions to manage high wattage packages. Options are available for heatsinking, heating and temperature sensing. Programmable heating is also available. Loranger International Corp. Your Turn Key Solution for Sockets and Boards for Over 30 Years
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