Andon Ultra Low Profile Solder Form Sockets™ ANDON SOLDER FORM SOCKETS™ • Solder preforms are assembled under the head of the socket terminal for low profile accurate solder volume and placement on your PCB • Cost savings by eliminating the need to apply flux or solder paste stencils. • Further cost savings by using removable […]

Andon’s BGA Sockets and Adapters provide an ideal method for mounting ball grid array devices onto a PCB. The device is soldered to the adapter, greatly simplifying solder verification and testing. The device/adapter assembly then plugs into the BGA socket, which is permanently soldered to the PCB. The BGA adapter is offered with either flat or countersunk heads. Our BGA sockets can […]

Heat Sink Socket™ As today’s high speed cameras achieve increasingly higher image resolution, the image sensor within gets increasingly hotter. Optoelectronic and gas sensors can also generate a lot of heat. As heat increases, noise increases geometrically. Now there’s a solution…Andon’s patented Heat Sink Sockets™combine heat dissipation with the traditional benefits of using a socket […]

Hi-Reliability Ultra Low Profile Carrier Socket Assemblies ·  Eliminate hand loading individual terminals ·  Prevents Contact Contamination During Soldering · Available in Any Configuration Carrier Socket Assemblies carry low profile terminals through your soldering process to provide a space saving perfectly pependicular, coplanar, and substrateless socket after soldering. After assembly, the carrier is either discarded or send back to factory […]

ANDON SOLDER FORM SOCKETS™ • Solder preforms are assembled under the head of the socket terminal for low profile accurate solder volume and placement on your PCB • Cost savings by eliminating the need to apply flux or solder paste stencils. • Further cost savings by using removable carried sockets. Great reduction in hand labor […]

High reliability sockets to cost effectively protect, test, assemble and replace power devices. Solder sockets on the PCB, plug in converters after assembly. Eliminate solder temperature damage and cleaning solvents. Avoid cracking glass seal. Reduce shock and damage to wire bonds.