Shortest spring pin, 1mm compressed height, provides highest electrical bandwidth 60GHz with lowest inductance of 0.17nH along with 2A continuous current carrying capacity. Quarter turn spring loaded lid allows gradual pressure to CSP with easy chip replacement functionality.

Quickly and easily socket your optoelectronic module (BGA64, 0.45mm pitch, 7.7x10mm size) and verify the performance equivalent to direct solder version using a high performance spring pin with low inductance of 0.17nH that operates from -40°C to +120°C.

With lever operated mechanism quickly and easily socket your 0.92mm pitch, 56x45mm size with 3184 contacts on any development platform with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55 °C to +160 °C along with liquid cooled lid that dissipates 300 watt power.

GT sockets are ideal for prototyping and testing almost any BGA device application that requires high signal integrity. This new elastomer technology has silver particles held in a conductive column like buttons which are embedded in a non-conductive polymer substrate on a proper pitch that provides high compliance and works in extreme temperature ranges.

Quickly and easily Socket your 1mm pitch 28×28 array, BGA783 packages on any application board with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55 °C to +160 °C.

Imperium Thermal Control System Developed specifically for low power applications, Ironwood Electronics’ IMPERIUM Thermal Control System integrates seamlessly with Ironwood’s test sockets and can be easily adapted to all sockets, providing exceptional thermal control in demanding applications. Building upon Ironwood’s leadership and expertise in high performance sockets, Imperium provides a smaller footprint, less noise, greater […]

Embedded Wire Elastomer Sockets for High Speed Applications SG elastomer sockets allow for very high speed testing of 0.3mm to 1.27mm pitch BGA, LGA, QFN, QFP and SOIC devices on the same footprint as other Ironwood socket technologies. Embedded Wire in Elastomer (SG) contact technology consists of a fine pitch matrix (0.05mm x 0.05mm) of […]